USPTO Patents Application 09930295

SEP 03 2002 17:28 FR 11111111111111111 111111111111 TO 342 1 U 1 34065B0 1 84 P . 02/04

* " " Application No, 09/93H95 Docket, M4065.0X84/P184-A

REMARKS

Claims 25-26 and 28-34 are currently pending in the above-identified
application. Claim 27 has been cancelled without prejudice or disclaimer to the subject
matter recited therein and solely for the purpose of furthering the prosecution of the
application. Applicants reserve the right to claim the subject matter of the cancelled claim
and other claims in this or any other application.

Claims 25 and 28-34 are rejected under 35 U.S.C. 102(b) as being anticipated
by Heo. Reconsideration is respectfully requested. Claim 25 discloses "a semiconductor
device package, comprising [] a metal layer formed between said semiconductor device and
said dielectric substrate having edges formed by said dicing operation." This is an
important feature of the invention. Heo does not teach or suggest the metal layer of the
claimed invention. Rather, Heo provides a "multi-layer film" 20 which includes "a first
non-conductive film 21, a second non-conductive film 22 and a circuit pattern 26." (col.
4, lines 58-62). Thus, the metal layer of the claimed invention is not disclosed in Heo.

The metal layer 62 in the claimed invention is not the circuit pattern, but a solid
layer to stiffen the semiconductor device package and furthermore to be used as a heat sink
to dissipate heat from the semiconductor device. In addition, the metal layer may be used
as an electrical ground plane. Heo's device, i.e. die multi-layer film, does not anticipate the
claimed invention which has a metal layer between the semiconductor device and the
dielectric substate. Claims 28-34 should be allowable along with claim 25 and for other

reasons.

Claim 26 is rejected under 35 U.S.C. 103(a) as being unpatentable over Heo in
view of Marcantonio. Reconsideration is respectfully requested. Claim 26 should be
allowable along with claim 25 . Furthermore, Marcantonio does not teach or suggest a
metal layer between the semiconductor device and the dielectric substrate but discloses a
metal layer "on one side of the dielectric body of the package." (col. 4, lines 48-49).
More specifically, Marcantonio provides a "heat spreader" 214 which is disposed on_a_sid£

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SEP 03 2002 17:28 FR 11111111111111111 111111111111 TO 342 1 tt 1 3406580 1 84 P . 03/04
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Application No.: 09/930,295

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Docket No.: M4065.0184/P184-A

opposite to that of both the integrated circuit chip 212 and the dielectric layers 224, 226,
228 (col. 4, lines 41-67). Marcantonio would suffer from the drawbacks of the prior art
described in Applicant's specification on page 2, namely, a package without sufficient
stiffness.

In view of the above, each of the presendy pending claims in this application is
believed to be in immediate condition for allowance. Accordingly, the Examiner is
respectfully requested to withdraw the outstanding rejection of the claims and to pass this
application to issue.

Dated: September 3, 2002

Respectfully submitted,

Mark J. Thronson

Registration No.: 33,082
DICKSTEIN SHAPIRO MORIN &

OSHINSKY LLP
2101 L Street NW
Washington, DC 20037-1526
(202) 785-9700
Attorneys for Applicant

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